Xilinx is the inventor of the FPGA, programmable SoCs, and now, the ACAP. Our highly-flexible programmable silicon, enabled by a suite of advanced software and tools, drives rapid innovation across a wide span of industries and technologies – from consumer to cars to the cloud. Xilinx delivers the most dynamic processing technology in the industry, enabling rapid innovation with its adaptable, intelligent computing. ProMik developes sophisticated bootloader technologies and FPGA configuration for inline flash programming solutions for on board programming challenges in production.
ZYNQ Ultrascale+ SOCs
Zynq® UltraScale+™ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. Built on a common real-time processor and programmable logic equipped platform, three distinct variants include dual application processor (CG) devices, quad application processor and GPU (EG) devices, and video codec (EV) devices, creating unlimited possibilities for applications such as 5G Wireless, next generation ADAS, and Industrial Internet-of-Things.
With 7 series FPGAs, Xilinx introduces a new high- metal gate (HKMG), high-performance, low-power (HPL) variant of 28nm process technology. The resulting Artix-7, Kintex-7, and Virtex-7 FPGAs allow designers to achieve low power consumption, get the most usable performance out of the process technology, and maximize productivity. The 7 series also brings to market the world’s first stacked silicon Interconnect FPGA, the Virtex-7 2000T, made possible by Xilinx patented FPGA architectural innovations and advanced foundry processes
Xilinx’s new 16nm and 20nm UltraScale™ families are based on the first architecture to span multiple nodes from planar through FinFET technologies and beyond, while also scaling from monolithic through 3D ICs. At 20nm Xilinx pioneered the first ASIC-class architecture to enable multi-hundred gigabit-per-second levels of system performance with smart processing at full line rates, scaling to terabits and teraflops. At 16nm, UltraScale+ families combine new memory, 3D-on-3D, and multi-processing SoC (MPSoC) technologies to deliver a generation ahead of value.
Job-file handling for full parallel 4up-panel production programming
- Dedicated PowerUp sequence for Power ManagemtIC (PMIC) via SPI driven by main MCU software
- Download of customer bootloader control for Zynq Ultrascale Fusing via Daisy Chain JTAG
- RunTime communication with customer bootloader for test functions
- Extendend logging functions for FlashTaskPro §Integration of CyberSecuritymodule enables:
Decryption of data containers for HSM & UCB key programming for Main MCU